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sf335c

特点

●无卤无磷,阻燃性ul94v-0。

●粘结强度高,尺寸稳定性好。

●优秀的耐热性、耐化学性和电性能。

●溢胶量低,加工性好,适于快速压合和传统压合。

●满足rohs指令要求,不含铅、汞、镉、六价铬、

多溴联苯、多溴联苯醚等。

应用领域

挠性印制电路用覆盖膜。

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items method condition unit typical value
peel strength (90°)* ipc-tm-650 2.4.9d accepted n/mm 1.13
288℃, 5s 1.17
solder resistance ipc-tm-650 2.4.13.f 288℃, 10s - no delamination
dimensional stability sy method after peeling off the paper
% 0.0313/0.0415
chemical resistance ipc-tm-650 2.3.2g after chemical exposure % >90
electric strength ipc-tm-650 2.5.6.2a d-48/50 d-0.5/23 kv/mm 105
volume resistivity ipc-tm-650 2.5.17e c-96/35/90 mω-cm 2.0×106
surface resistance ipc-tm-650 2.5.17e c-96/35/90
1.5×105
dielectric constant (10ghz) spdr c-24/23/50 - 3.27
dissipation factor (10ghz) spdr c-24/23/50
- 0.019
resin flow ipc-tm-650 2.3.17.1 180℃/10 60s,100kg/cm2
mm <0.15
flammability ul94 e-24/125 rating v-0

remarks:

* certified to ipc-4203/2 epoxy adhesive on one or two sidesof poyimide dielectric and shengyi standard.

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