生益科技-8858cc永利官网

cn/en

sdi03k

特点

● 无铅兼容

● 高tg无卤,tg 175℃ (tma)
● uv阻挡/aoi兼容
● 较低的z轴cte


应用领域

适用于智能手机,笔记本电脑,平板电脑,仪表盘,录像机,电视,电子游戏机,通讯设备等

  • 产品性能
  • 产品证书
  • 资料下载
items method condition unit typical value
tg 2.4.24.4 dma 200
2.4.24 tma 175
td 2.4.24.6 5% wt. loss 390
t288
2.4.24.1 tma min >60
t260 2.4.24.1
tma min
>60
thermal stress
2.4.13.1
288℃, solder dip
- pass
cte (z-axis) 2.4.24 before tg ppm/℃ 40
after tg ppm/℃ 230
50-260℃ % 2.3
dissipation constant (1ghz) 2.5.5.9 c-24/23/50 - 3.47
dissipation factor (1ghz)
2.5.5.9
c-24/23/50
- 0.0083
volume resistivity 2.5.17.1 c-96/35/90 mω.cm 4.76×108
surface resistivity
2.5.17.1
c-96/35/90 1.84×107
arc resistance 2.5.1 d-48/50 d-0.5/23 s 181
dielectric breakdown 2.5.6 d-48/50 d-0.5/23 kv >45
peel strength (h oz)
2.4.8
288℃/10s
n/mm
1.1
flexural strength (lw/cw)
2.4.4
a mpa
510/490
water absorption 2.6.2.1 e-1/105 d-24/23 % 0.07
flammability
ul94
c-48/23/50
rating
v-0

remarks:

1. all the typical value is based on the 1.0mm specimen, while the tg is for specimen≥0.50mm, and the dielectric strength is based on other thickness specimen mentioned above.
2. all the typical values listed above are for your reference only and not intended for specification. please contact shengyi technology co., ltd. for detailed information. all rights from this data sheet are reserved by shengyi technology co., ltd.
explanation: c=humidity conditioning, d=immersion conditioning in distilled water, e=temperature conditioning
the first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.
网站地图