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| items | method | condition | unit | typical value | |
|---|---|---|---|---|---|
| tg | ipc-tm-650 2.4.25d | dsc | ℃ | 155 | |
| ipc-tm-650 2.4.24.4 | dma | ℃ | 160 | ||
| td | ipc-tm-650 2.4.24.6 | 5% wt. loss | ℃ | 348 | |
| cte (z-axis) | ipc-tm-650 2.4.24 | before tg | ppm/℃ | 37 | |
| after tg | ppm/℃ | 230 | |||
| 50-260℃ | % | 2.8 | |||
| t260 | ipc-tm-650 2.4.24.1 | tma | min | >60 | |
| t288 | ipc-tm-650 2.4.24.1 | tma | min | 20 | |
| thermal stress | ipc-tm-650 2.4.13.1 | 288℃, solder dip | s | >100 | |
| volume resistivity | ipc-tm-650 2.5.17.1 | after moisture resistance | mω.cm | 1.5e 08 | |
| e-24/125 | mω.cm | 3.2e 06 | |||
| surface resistivity | ipc-tm-650 2.5.17.1 | after moisture resistance | mω | 3.5e 07 | |
| e-24/125 | mω | 2.3e 06 | |||
| arc resistance | ipc-tm-650 2.5.1 | d-48/50 d-4/23 | s | 150 | |
| dielectric breakdown | ipc-tm-650 2.5.6 | d-48/50 d-4/23 | kv | >45 | |
| dissipation constant (dk) | ipc-tm-650 2.5.5.9 | 1ghz | -- | 4.6 | |
| iec 61189-2-721 | 10ghz | -- | — | ||
| dissipation factor (df) | ipc-tm-650 2.5.5.9 | 1ghz | -- | 0.011 | |
| iec 61189-2-721 | 10ghz | -- | — | ||
| peel strength (1oz hte copper foil) | ipc-tm-650 2.4.8 | a | n/mm | — | |
| after thermal stress 288℃,10s | n/mm[lb/in] | 1.3[7.43] | |||
| 125℃ | n/mm | — | |||
| flexural strength | lw | ipc-tm-650 2.4.4 | a | mpa | 530 |
| cw | ipc-tm-650 2.4.4 | a | mpa | 440 | |
| water absorption | ipc-tm-650 2.6.2.1 | e-1/105 d-24/23 | % | 0.09 | |
| cti | iec60112 | a | rating | plc 3 | |
| flammability | ul94 | c-48/23/50 | rating | v-0 | |
| e-24/125 | rating | v-0 | |||
remarks:
1. specification sheet: ipc-4101/99, is for your reference only.
2. all the typical value is based on the 1.6mm(8*7628) specimen.
3. all the typical value listed above is for your reference only, please turn to shengyi technology co., ltd for detailed
information, and all rights fromthis data sheet are reserved by shengyi technology co., ltd.