shengyi technology co., ltd.-8858cc永利官网

product

s1125

characteristic


●  halogen free, dicy curedsystems,normal tg;

●  free of constituents suchas antimony,red phosphorous etc..

●  good adhesion to thesurface.



application area

mobile phone, computer ,instrumentation,vcr, communication equipment etc..
  • product performance
  • product certificate
  • data download
items method condition unit typical value
tg ipc-tm-650 2.4.25 dsc 130
td ipc-tm-650 2.4.24.6 5% wt. loss 350
cte(z-axis) ipc-tm-650 2.4.24 before tg ppm/℃ 40
after tg
ppm/℃ 235
50-260℃ %
3
t288 ipc-tm-650 2.4.24.1 tma min 30
thermal stress ipc-tm-650 2.4.24.13 288℃, solder dip --

>100s

flexural strength

ipc-tm-650 2.4.4
a mpa
580/lw
a mpa
450/cw
peel strength ipc-tm-650 2.4.8 copper (1/2 oz) n/mm 1.2
water absorption ipc-tm-650 2.6.2.1 e-1/105 d-24/23 % 0.1
flammability ul94 e-24/125
rating v-0

remarks:


1.performance data based on the sample s1125 0.30mm testresults.

2.the test method of ps:superposition the ed copper foil(1oz),bonding film,s1125, then  laminate them ,using the pararmeters 170℃、200psi,40 minutes.using 90 degree angle peelling.

3.all the typical value listed above is for your reference only,please turn to shengyi technology co., ltd. for detailed information, and all rights from this data sheet are reserved by shengyi technology co., ltd.

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