product
sf325c
characteristic
● excellent anti-ionmigration, no dendrite.
● halogen free, flammabilityul94 vtm-0.
● high bonding strength, gooddimensional stabilityand thermal resistance.
● low adhesive flowing, good processability,suitablefor both fast andtraditional lamination style.
● compatible with eu rohs directive, free of pb,hg,cd, cr6 ,pbb,pbde,etc..
application area
coverlay for fpc- product performance
- product certificate
- data download
| items | method | condition | unit | typical value |
|---|---|---|---|---|
| peel strength(90°)* | ipc-tm-650 2.4.9d | accepted | n/mm | 1.2 |
| 288℃、5s | 1.1 | |||
| solder resistance | ipc-tm-650 2.4.13.f | 288℃、10s | - | no delamination |
| dimensional stability | sy method | after peeling off the paper | % | -0.0083/-0.0021 |
| chemical resistance | ipc-tm-650 2.3.2g | after chemical exposure | % | ＞90 |
| electric strength | ipc-tm-650 2.5.6.2a | d-48/50 d-0.5/23 | kv/mm | 100 |
| volume resistivity | ipc-tm-650 2.5.17e | c-96/35/90 | mω-cm | 2×108 |
| surface resistance | ipc-tm-650 2.5.17e | c-96/35/90 | mω | 1.5×106 |
| dielectric constant(10ghz) | spdr | c-24/23/50 | - | 3.4 |
| dissipation factor(10ghz) | spdr | c-24/23/50 | - | 0.017 |
| resin flow | ipc-tm-650 2.3.17.1 | 180℃/10 60s,100kg/cm2 | mm | ＜0.15 |
| flammability | ul94 | e-24/125 | rating | v-0 |
remarks:
*testing after laminating with shining side of copper foil in suitablecondition
1.certified to ipc-4203/2 epoxy adhesive on one or twosides of poyimide dielectric
2.all the typical value listed above is for your reference only,please turn to shengyi technology co., ltd. for detailed information, and all rights from this data sheet are reserved by shengyi technology co., ltd.