product
sf215c
characteristic
●low transparence, excellentlight-blocking.
●flammability ul94 v-0.
●excellent solderingreliability, chemical resistance and electrical properties.
●low adhesive flowing, good processability,suitable for both fast and traditional lamination style.
●compatible with eu rohs directive, free of pb,hg,cd, cr6 ,pbb,pbde,etc..
application area
coverlayfor fpc.
- product performance
- product certificate
- data download
items | method | condition | unit | typical value |
---|---|---|---|---|
peel strength (90°)* | ipc-tm-650 2.4.9d | accepted | n/mm | 0.71 |
288℃, 5s | 0.7 | |||
solder resistance | ipc-tm-650 2.4.13.f | 288℃, 10s | - | no delamination |
dimensional stability | sy method |
after peeling off the paper |
% | -0.0304/-0.0151 |
chemical resistance | ipc-tm-650 2.3.2g | after chemical exposure | % |
>85 |
volume resistivity | ipc-tm-650 2.5.17e | c-96/35/90 | mω-cm |
4.1×108 |
surface resistance | ipc-tm-650 2.5.17e | c-96/35/90 |
mω |
1.2×105 |
dielectric constant (10ghz) | spdr | c-24/23/50 | - | 4.22 |
dissipation factor (10gmhz) | spdr |
c-24/23/50 |
- | 0.0405 |
resin flow | ipc-tm-650 2.3.17.1 |
180℃/10 60s,100kg/cm2 |
mm | <0.15 |
flammability | ul94 |
e-24/125 |
rating |
v-0 |
remarks:
* certified to ipc-4203/2 epoxy adhesive on one or two sidesof poyimide dielectric