product
st115g
characteristic
● excellent heat dissipation
● excellent thermal and insulation reliability
● lower z-axis cte., high cti
● halogen-free, tg 175℃(dma)
application area
● pcb heat dissipation solution
● automotive electronics, led headlamp
● consumer electronics(intelligent terminal, ssd)
- product performance
- product certificate
- data download
items | method | condition | unit | typical value |
---|---|---|---|---|
thermal conductivity | astm-d5470 | a | w/ (m•k) | 1.6 |
|
astm e1461 | a |
|
2.0 |
tg | 2.4.25d | dsc | ℃ | 170 |
td |
2.4.24.6 | wt 5% loss | ℃ | 410 |
thermal stress | 2.4.13.1 | 288℃, solder float |
min |
>30 |
cte (z-axis) | 2.4.24 | before tg | ppm/℃ | 37 |
after tg | ppm/℃ | 166 | ||
50-260℃ | % | 2.2 | ||
volume resistivity | 2.5.17.1 | c-96/35/90 | mω/cm | 108 |
surface resistivity |
2.5.17.1 |
c-96/35/90 | mω |
107 |
dielectric breakdown | 2.5.6 | d-48/50 d-0.5/23 | kv | >45 |
peel strength (1oz) | 2.4.8 | 288℃/10s | n/mm | 1.05 |
flammability |
ul94 |
c-48/23/50 |
rating |
v-0 |
water absorption |
ipc-tm-650 2.6.2.1 |
e-1/105 d-24/23 | % | 0.11 |
cti | iec60112 | a | rating | plc0 |
remarks:
remarks:
1. all the typical value is based on the 1.0mm specimen, while the tg is for specimen≥0.50mm.
2.all the typical values listed above are for your reference only and not intended for specification. please contact shengyi technology co., ltd. for detailed information. all rights from this data sheet are reserved by shengyi technology co., ltd.
3. ul certificated single/double side pcb min. thickness 0.38mm.
explanation: c=humidity conditioning, d=immersion conditioning in distilled water, e=temperature conditioning
the first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.